Chemical Mechanical Planarization (CMP) - Why do you need it?

This is an interactive simulation of Chemical Mechanical Planarization Select the button below to run the simulation on your PC!

	Run the Simulation.   See why CMP is essential in the semiconductor production process. (66K)

Chemical Mechanical Planarization (CMP) is used primarily to produce a smooth, flat surface on a wafer prior to photolithography.  This simulation illustrates why this is essential for today's high density semiconductors.

CMP is also essential in the new copper process, to remove excess copper from wafers. See how this works in the Virtual Cleanroom simulation.

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