Momentumä is a high-throughput, dry-in/dry-out universal CMP system that offers capability for all process applications (copper, low-k, shallow trench isolation, oxide, tungsten and poly), high productivity, processing flexibility, and extendibility to future technology nodes. It combines the benefits of the previous rotational and orbital platforms to meet the 0.18 µm and 0.13 µm design node requirements, with extendibility to the 0.10 µm node. The Momentum platform has four independent wafer-polishing platens, which allow for maximum manufacturing flexibility.

Select the "e-try" button above to run an interactive Momentumä simulation.

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