TRY IT! The Copper Alliance combines the strengths of Novellus, Lam Research and SpeedFam-IPEC to provide a complete copper process to the Semiconductor Industry.

<body bgcolor="black"> <a href="index.html"></a> <a href="momentum.htm"></a> <a href="vision.htm"></a> <a href="questerapt.htm"></a> <a href="grid.htm"></a> <a href="semiproc.htm"></a> <a href="litho.htm"></a> <a href="stepvscan.htm"></a> <a href="met.htm"></a> <a href="apc.htm"></a> <a href="whycmp.htm"></a> <a href="PTI.htm"></a> <a href="pti_spanish.htm"></a> <a href="sealcheck.htm"></a> <font color="#FFFFFF" face="Verdana,helvetica,sans-serif"><p>This page uses frames, but your browser doesn't support them.</p> <p>The Copper Showroom features products from Copper Alliance members to provide a complete copper process for the Semiconductor Industry. The SpeedFam-IPEC AvantGaard 776 Orbital Chemical Mechanical Planarization (CMP) System provides complete dry-in/dry-out wafer processing. The Novellus Dual SEQUEL EXPRESS offers a low risk manufacturing solution, superior film quality, and high productivity with minimal non-value added time. The Novellus INOVA is an advanced PVD system that delivers highly conformal barrier and seed layers for copper metallization. The Novellus SABRE is an advanced electrofill system that enables void-free copper in extremely narrow, high aspect ratio IC structures without backside contamination. The Lam Research Exelan dual-frequency dielectric etch system provides the lowest cost of ownership solution for sub-0.18 um devices.</p> </font> </body>