TRY IT! Chemical Mechanical Planarization (CMP) prior to Photolithography

<body><table dir="ltr" border="0" cellpadding="0" cellspacing="0" width="100%"><tr><td valign="top"> <a href="index.html"></a> <a href="momentum.htm"></a> <a href="vision.htm"></a> <a href="questerapt.htm"></a> <a href="grid.htm"></a> <a href="semiproc.htm"></a> <a href="litho.htm"></a> <a href="stepvscan.htm"></a> <a href="met.htm"></a> <a href="apc.htm"></a> <a href="PTI.htm"></a> <a href="pti_spanish.htm"></a> <a href="sealcheck.htm"></a> <a href="copper.htm"></a> <p>Chemical Mechanical Planarization is necessary prior to photolithography</p> <p> Chemical Mechanical Planarization (CMP) is used primarily to produce a smooth, flat surface on a wafer prior to photolithography.  This is essential for today's high density semiconductors.</p> <p>CMP is also essential in the new copper process, to remove excess copper from wafers.</p> </td></tr></table><table border="0" cellpadding="0" cellspacing="0" width="100%"><tr><td> <p><font face="Arial" size="1">Copyright 1998-<span lang="en-us">2011</span> Qameleon Technology, Inc.</font> </p> </td></tr></table></body>